| abstract |
[PROBLEMS] To handle without bending or peeling even when bent, and bump electrodes can be laminated on the electrode side of a semiconductor wafer with a bump electrode having a narrow pitch and a high pin count at the time of lamination, and cutting at the time of dicing Disclosed is an adhesive composition for a semiconductor that can be cut at high speed without contamination or chipping of powder, and can easily recognize alignment marks during dicing and flip chip mounting. (A) An organic solvent-soluble polyimide, (b) an epoxy compound, (c) a curing accelerator, and (b) 100 parts by weight of the epoxy compound, and (a) 15 organic solvent-soluble polyimide. -90 parts by weight, (c) 0.1-10 parts by weight of a curing accelerator, and (b) an epoxy compound that is liquid at 25 ° C. and 1.013 × 10 5 N / m 2 and 25 ° C. The adhesive composition for a semiconductor contains a compound that is solid at 1.013 × 10 5 N / m 2 , and the ratio of the liquid compound in all the epoxy compounds is 20 wt% or more and 60 wt% or less. |