http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006129458-A1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
filingDate | 2006-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2008-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2006129458-A1 |
titleOfInvention | Wafer with fixing agent and method for manufacturing wafer with fixing agent |
abstract | A wafer (100) with a fixing agent comprising a supporting wafer (1) and a fixing agent (2) disposed on the surface of the supporting wafer (1), which is disposed at an edge portion of the supporting wafer (1). A wafer (100) with a fixing agent, further comprising a penetration preventing structure (3), wherein the fixing agent (2) is disposed in a recess formed by the support wafer (1) and the penetration preventing structure (3). When the support wafer (1) and the wafer to be processed are bonded and fixed, it is possible to prevent the fixing agent (2) from protruding and to prevent contamination of the work environment. And a wafer to be processed, a wafer (100) with a fixing agent capable of preventing a liquid material from permeating between the workpiece and the wafer to be processed is provided. |
priorityDate | 2005-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 710.