http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006093293-A1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81395
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3185
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
filingDate 2006-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2008-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2006093293-A1
titleOfInvention Ceramic multilayer substrate and manufacturing method thereof
abstract A ceramic multilayer substrate excellent in migration resistance and having high bonding strength between the resin sealing material and the ceramic multilayer substrate main body and a method for producing the same are obtained. The entire laminated substrate body (2) is covered with a siloxane film formed by the PVD method, including the lands (16), (17) and the external electrodes (24), (25). The thickness of the siloxane film is set to less than 100 nm. Thereafter, the external electrodes (13) and (14) of the mounting component (11) are electrically connected to the lands (16) and (17) of the multilayer substrate main body (2) by the solder (19) and firmly Fix it. Next, a resin sealing material (4) for sealing the mounting component (11) is formed on the multilayer substrate body (2).
priorityDate 2005-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63311794-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0752395-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004247334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001052323-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003309173-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06152111-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID977
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458433298
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523291

Total number of triples: 70.