| abstract |
In the epoxy resin composition containing an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler as essential components, the component of the inorganic filler includes spherical fused silica having a pH of 3 to 5, and silicon dioxide and titanium oxide. An epoxy resin composition for semiconductor encapsulation having excellent fluidity and moldability is provided, including the eutectic material or the eutectic material comprising silicon dioxide and alumina. |