http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006059363-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3254 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2004-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2006059363-A1 |
| titleOfInvention | Epoxy resin composition for prepreg, prepreg, multilayer printed wiring board |
| abstract | PROBLEM TO BE SOLVED: To produce a printed wiring board, particularly a multilayer printed wiring board, which does not generate a harmful substance at the time of combustion, has excellent flame resistance, solder heat resistance after moisture absorption, and has excellent thermal rigidity. Provided are an epoxy resin composition for prepreg, a prepreg, and a multilayer printed wiring board. SOLUTION: Phosphorus compounds having an average of 1.8 to less than 3 phenolic hydroxyl groups and an average of 0.8 or more phosphorus atoms in the molecule and specific (from biphenyl type, naphthalene type, dicyclopentadiene type, etc.) 20% by mass or more of a pre-reacted epoxy resin obtained by reacting a bifunctional epoxy resin in advance with an equivalent ratio of epoxy group / phenolic hydroxyl group of 1.2 to less than 3/1 A polyfunctional epoxy resin containing an average of 2.8 or more epoxy groups in one molecule, a curing agent comprising dicyandiamide and / or a polyfunctional phenolic compound, and a thermal decomposition temperature of 400 ° C. or more The epoxy resin composition containing the inorganic filler is used as a pre-plug for manufacturing a printed wiring board. [Selection figure] None |
| priorityDate | 2004-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.