| abstract |
The present invention shows good adhesion even when the surface roughness of the adhesive surface with the base resin layer of the electrolytic copper foil with carrier foil is small, and pinholes or the like remain in the bulk copper layer, or through holes To provide an electrolytic copper foil with a carrier foil provided with a primer resin layer in which an electrolytic copper foil layer and a base resin layer are difficult to peel off due to corrosion when an inner wall portion such as a via hole or a contact hole contacts a desmear liquid Objective. In order to achieve this object, a bonding interface layer, a bulk copper layer, a Ni—Zn-containing plating layer and a primer resin layer are sequentially formed on at least one surface of the carrier foil of the electrolytic copper foil with a carrier foil, and the Ni— Provided is an electrolytic copper foil with a carrier foil provided with a primer resin layer in which a Zn-containing plating layer contains Ni and Zn and the Ni / Zn adhesion ratio is 1.5 to 10, and a method for producing the same. |