http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006011508-A1
Outgoing Links
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|---|---|
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| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-186 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4694 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2005-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2006011508-A1 |
| titleOfInvention | COMPOSITE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
| abstract | In the case of the circuit component built-in module described in Patent Document 1, since a wiring pattern is formed on at least one main surface of the electrically insulating substrate in which the circuit component is embedded, a plurality of types of circuit components are electrically insulated. Even if it is built in the substrate, the height of the circuit component is limited to the height of the electrically insulating substrate, and even if it becomes high-density wiring, it is difficult to provide a wiring layer inside the electrically insulating substrate in which the circuit component is embedded. The wiring layers must be provided above and below the electrically insulating substrate, and it is difficult to reduce the height. The composite electronic component 10 of the present invention includes a multilayer wiring block 11 having a plurality of insulating layers 11A and a wiring pattern 11B, a first chip type having a plurality of insulating layers 12B and a wiring pattern 12C. A multilayer block 12 with a chip-type electronic component built-in that includes the electronic component 12A. The multilayer wiring block 11 and the multilayer block 12 with a chip-type electronic component are electrically connected to each other and arranged on the same plane. |
| priorityDate | 2004-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419584836 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID105034 |
Total number of triples: 32.