http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006009118-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C233-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2005-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2006009118-A1 |
| titleOfInvention | Heat-resistant and water-soluble flux composition for solder |
| abstract | PROBLEM TO BE SOLVED: To provide a water-soluble flux composition which is a soldering flux composition which is particularly excellent in heat resistance and can be easily removed by washing with water and warm water after soldering. SOLUTION: Formula (1): [Chemical 1] (However, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 each represent a hydrocarbon group or a hydrogen atom, and A 1 , A 2 and A 3 are each a hydroxyl group or a formula (2): [Chemical 2] And at least one of A 1 , A 2 , and A 3 is an organic group of the formula (2). The solder flux composition containing the compound shown by this. [Selection figure] None |
| priorityDate | 2004-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.