| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-103 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2005-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2005097892-A1 |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract |
Epoxy resin, phenol resin, inorganic filler, curing accelerator, semiconductor encapsulant containing glycerin trifatty acid ester and hydrotalcite compound obtained by dehydration condensation reaction of glycerin and saturated fatty acid having 24 to 36 carbon atoms as essential components By using an epoxy resin composition for fastening, it is possible to provide an epoxy resin composition for semiconductor encapsulation that has excellent mold releasability during molding and has little mold contamination and semiconductor package surface contamination, and a semiconductor device having excellent solder resistance. Can be provided. |
| priorityDate |
2004-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |