| abstract |
Disclosed is a method for producing a multilayer substrate, in which the relative position between layers is prevented from being shifted, and the position of a portion that electrically connects the layers is formed with high accuracy. The multilayer substrate manufacturing method of this embodiment is the first method in which a wiring layer (14) formed by patterning a conductive film (13) is stacked via an insulating film (12). The confirmation hole (14) is provided in the conductive film (13) to be formed, and after the position of the confirmation portion (14) is recognized, the second and subsequent wiring layers (18) are patterned. . Further, in this embodiment, a connection portion that connects the wiring layers is formed using this confirmation portion. |