http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2005056632-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-259 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0245 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2004-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2005056632-A1 |
| titleOfInvention | Thermosetting resin composition, resin sheet and resin sheet for insulating substrate |
| abstract | Excellent dielectric properties, excellent dimensional stability at high temperature, and small dimensional change before and after thermal history even when subjected to thermal history exposed to high temperature, that is, low linear expansion coefficient For example, a thermosetting resin composition capable of obtaining a molded body such as a resin sheet, a resin sheet using the thermosetting resin composition, and a resin sheet for an insulating substrate are provided. A thermosetting resin composition comprising an epoxy resin having an epoxy equivalent of 100 to 2000, an epoxy resin curing agent which is a compound having a phenol group, and a layered silicate, and the above thermosetting resin composition And a resin sheet for an insulating substrate constituted by using the resin sheet. |
| priorityDate | 2003-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 213.