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filingDate 2003-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2004039526-A1
titleOfInvention Soldering method and device
abstract (A) during soldering, (b) before soldering and (c) after soldering, at least in (a) soldering and (b) before soldering, (d) solder material, (e) An alternating current whose frequency changes temporally in a band of 20 Hz to 1 MHz is passed through at least one of the soldering target and (f) its peripheral portion, and a modulated electromagnetic wave treatment is performed by an electromagnetic field induced by the alternating current. This is a soldering method that uses not only lead-containing solder materials but also lead-free solder materials, which improves the wettability when soldering to the soldering object, and the strength of the soldered products obtained is the same as before. Improves compared to other solder materials.
priorityDate 2002-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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