| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0118 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H37-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H37-04 |
| filingDate |
2003-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2004024618-A1 |
| titleOfInvention |
Microdevice and manufacturing method |
| abstract |
A microdevice that is manufactured by a semiconductor process and operates while being electrically connected to the outside, comprising: a wiring board; an electrode pad provided on the wiring board; and a lead board provided substantially parallel to the wiring board; A lead of a conductive member, one end of which is fixed to the lead substrate and the other end is freely held, and is electrically connected to the electrode pad by being bent in an out-of-plane direction of the lead substrate. . |
| priorityDate |
2002-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |