| abstract |
The present invention uses a highly heat-conductive sintered body mainly composed of diamond having excellent characteristics as a heat sink for an electronic device such as a semiconductor laser or a high-performance MPU (microprocessing unit), a manufacturing method thereof, and a sintered body thereof. For heat sinks, we offer heat sinks that combine high thermal conductivity and thermal expansion, ideal for mounting semiconductor devices with large sizes and high thermal loads, such as high-power semiconductor lasers and high-performance MPUs. can do. In addition, since the characteristics of thermal conductivity and thermal expansion coefficient can be adjusted relatively freely, an optimum heat sink can be selected in accordance with the characteristics and design of the mounted element. |