http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2003016420-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
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filingDate 2002-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2004-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2003016420-A1
titleOfInvention Heat-reactive flame-retardant pressure-sensitive adhesive tape and method for producing the same
abstract The present invention relates to a heat-reactive flame-retardant pressure-sensitive adhesive tape having high flame retardancy and a method for producing the same. A dripping inhibitor and a flame retardant are added to a photocurable pressure-sensitive adhesive containing at least a (meth) acrylic acid alkyl ester monomer, a polar group-containing monomer, and a photopolymerization initiator as main components. In a heat-reactive flame-retardant pressure-sensitive adhesive tape obtained by applying a solvent-type photocurable pressure-sensitive adhesive on a substrate, a photoactive functional group is used as the dripping inhibitor with respect to 100 parts by weight of the photocurable pressure-sensitive adhesive. By mixing 5 to 50 parts by weight of a hydroxy group-containing monomer having a group and 5 to 100 parts by weight of phosphazene and 10 to 200 parts by weight of hydrated alumina as the flame retardant, a thermal reaction having high flame retardancy To manufacture mold-type flame-retardant adhesive tapes.
priorityDate 2001-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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