http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2003004262-A1
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C30-00 |
filingDate | 2002-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2004-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2003004262-A1 |
titleOfInvention | Laminate and manufacturing method thereof |
abstract | The metal layer A is formed on one surface of the polymer film by a dry plating method. When a circuit is formed by a semi-additive method using this laminate, a high-density printed wiring board excellent in the shape of circuit wiring, insulation between circuits, and adhesion to a substrate can be obtained. Further, by forming an adhesive layer on the other surface of the polymer film of the laminate, an interlayer adhesive film can be obtained. After attaching the interlayer adhesive film to the inner layer circuit board, the adhesive layer is heat-sealed or cured, whereby a multilayer printed wiring board can be manufactured. When manufacturing the circuit board, it is preferable to use an etchant that selectively etches the first metal film when etching the first metal film. |
priorityDate | 2001-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 166.