Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
filingDate |
2002-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2004-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-WO2002092693-A1 |
titleOfInvention |
Thermal conductive silicone composition |
abstract |
A thermally conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a thermally conductive filler, and (C) a specific organosiloxane. Even if a large amount of a thermally conductive filler is contained in order to obtain a highly thermally conductive silicone composition, it is possible to provide a thermally conductive silicone composition having good handling workability. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10870786-B2 |
priorityDate |
2001-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |