| abstract |
The liquid thermosetting resin composition is a composition containing (A) an epoxy resin, (B) a curing catalyst, and (C) a filler, and has a viscosity at 25 ° C. of 1500 dPa · s or less and a melt viscosity of 10 dPa · s. The gel time at the following temperature is 300 seconds or more, and the gel time at 130 ° C. is 600 seconds or less. Upon laminating the interlayer resin insulating layer and the conductor circuit on the surface of the wiring board on which the conductor circuit pattern including the hole was formed to produce a printed wiring board, the above composition was filled into the hole, heated and pre-cured. Thereafter, the portion protruding from the surface of the hole is polished and removed, and the hole is filled by heating and fully hardened. In this manner, the filling of via holes, through holes and the like in the printed wiring board can be performed with good workability. |