| abstract |
It has high heat resistance, narrow pitch wiring pattern, small diameter via, uniform insulating layer thickness, and stability of adhesion between metal layer and synthetic resin film, making it possible to reduce the size, performance, and functionality of electronic devices. It is an object of the present invention to provide a laminate for use in a printed wiring board and a multilayer printed wiring board which contribute. The present invention relates to a metal laminate having a metal layer provided on one or both sides of a synthetic resin film, wherein the metal layer is a metal foil of 5 μm or less. The present invention also relates to a metal laminate having a metal layer having a thickness of 5 μm or less on one or both sides of a synthetic resin film, wherein the synthetic resin film is partially imidized or partially dried. The film is immersed or dipped in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium. The present invention relates to a laminate, which is a polyimide film containing at least one element obtained by completely drying and imidizing the polyamic acid film after applying the polyamic acid film. |