http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2002027407-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-091 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F291-00 |
| filingDate | 2001-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2002027407-A1 |
| titleOfInvention | Resist pattern, its manufacturing method and its use |
| abstract | According to the present invention, the film thickness is 1 to 100 μm, and the aspect ratio ( A resist pattern having a ratio of the line width to the thickness of the resist pattern) of 3.5 or more is provided. The resist pattern includes, for example, (A) a binder polymer, (B1) a photopolymerizable compound having three ethylenically unsaturated bonds in a molecule, (C) a photopolymerization initiator, and (D) a general formula (I) : (In the formula, m is an integer of 2 to 6.) Or a compound represented by the general formula (II): Can be produced using a photosensitive resin composition containing one or both of the compounds represented by |
| priorityDate | 2000-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 157.