http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2002023275-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-141 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-20 |
| filingDate | 2001-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2002023275-A1 |
| titleOfInvention | Ultraviolet curable resin composition and photo solder resist ink containing the same |
| abstract | Epoxy group-containing polymer (a) obtained by polymerizing ethylenically unsaturated monomer component containing epoxy group-containing ethylenically unsaturated monomer (i), and epoxy group-containing isocyanurate derivative (b) Is reacted with an ethylenically unsaturated monomer (c) having a carboxyl group, and the resulting intermediate product is reacted with a saturated or unsaturated polybasic acid anhydride (d). UV curable resin (A) obtained by the above method; an epoxy compound (B) having two or more epoxy groups in a molecule; a photopolymerization initiator (C); and a UV curable resin composition containing a diluent (D). I will provide a. The photo solder resist ink containing the resin composition can be developed with a dilute alkaline aqueous solution, and can form a solder resist having excellent solder heat resistance and gold plating resistance on a substrate. |
| priorityDate | 2000-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 194.