http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6489496-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16315 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-064 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F02B77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate | 1987-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6e4f17daf1852591d0f1fca8ffc54d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_532f6f851d5bfd478aae46d567843755 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da8a927e1f8634b975add5638f456acb |
| publicationDate | 1989-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S6489496-A |
| titleOfInvention | Sealing structure of automobile electronic circuit |
| abstract | PURPOSE:To ensure sufficiently fluid-tightness for saline water of thermal impact, by mounting not only a protrusion around the whole peripheral part of a metallic base but also a stepped part adjacent to the foregoing protrusion and filling even the stepped part of the metallic base with adhesives which fill the grooved part of the base of a mold resin case where the foregoing protrusion is fitted in. CONSTITUTION:A recessed part 28 which is provided at a mold case 16 is fitted with adhesives 33 and after that, the protrusion 29 of an aluminum base 13 is inserted into the recessed part. As a part of the adhesives spreads over between the mold case 16 and the aluminum base 13, other part of the adhesives remains at an adhesive pool 32 which is formed by a stepped part 30 consisting of an outside wall 31 and the aluminum 13. Since the protrusion 29 of the aluminum base is fitted at the recessed part 28 of the mold case 16, its structure prevents the development of shearing force at the interface of bonding. Further, even though the splicing part is splashed with saline water and salinity is crystallized, the surface of the adhesive pool 32 is relatively so spacious that the effect of a wedge prevents stripping or crack development at the splicing part between the adhesives 32 and the mold case 16. Thus, a junction structure which exhibits a high resistance to briny water is realized. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107836139-A |
| priorityDate | 1987-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.