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filingDate 1987-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ccb292f9706e7e8f8fc3b1b600a2678
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publicationDate 1989-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S6448803-A
titleOfInvention Photosensitive resin composition
abstract PURPOSE:To obtain the title compsn. comprising a specified acridyl side group- contg. photopolymn. initiator, a thermoplastic org. polymer and an ethylene- terminated photopolymerizable compd. and being highly photosensitive and free from solder melting after etching. CONSTITUTION:The title product is a photosensitive resin compsn. contg. a photopolymn. initiator A having a wt.-average MW of at least 320 and having an acridyl side group of the formula as shown [where R1-R8 are each H, a halogen, 1-8C alkyl or methoxy; X is a (substd.)arom. ring conjugated with an acridyl group] [e.g., 9-(p-n-hexylphenyl)acridine, etc.], and a photopolymerizable compd. C having at least one terminal ethylene group (e.g., trimethyloylpropane triacrylate, etc.). This comps. is highly photosensitive and is free from solder melting after etching, so that it can be used in forming a precision circuit.
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priorityDate 1987-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 35.