http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6420232-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 1987-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd1ece97b9e6d47fd5400d06fa0401a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1da6aca045b9137510df5b1d1070f5b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ee8bf0a8fbf6f0b6f5dc6509ae3d308 |
| publicationDate | 1989-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S6420232-A |
| titleOfInvention | Low-stress polyimide |
| abstract | PURPOSE:To obtain a polyimide free of any residual stress when applied to a low-thermal expansion material and cured, and excellent in mechanical strengths and processability of a precursor, containing specified repeating units. CONSTITUTION:A polyamic acid (derivative) obtained by reacting a tetracarboxylic acid (derivative) (e.g., pyromellitic anhydride) with a diamine (derivative) (e.g., p-phenylenediamine or 2,5-toluylenediamine) is applied, molded or formed into a film, and cured by heating to obtain a polyimide resin which contains at least two kinds of repeating units of the formula (wherein n is 0-4) and in which the proportions of said repeating units are each at most 70mol.% based on the total. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1054616-C |
| priorityDate | 1987-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.