http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63307911-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24f54aefd7a75822ce9d6a7759e20068 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2075-00 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L22-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K75-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21D37-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21D24-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate | 1987-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db4db5d1a88f17fc690d37ea23d2efe9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6cf3f79562be879f0acbe360534a988 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40d5bfef08e094f49c4e27205076cf7d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05e5e7d190d1ccabec7c2f83dbf9d17f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e261c0a519f5e46272a13db76f6016a0 |
| publicationDate | 1988-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S63307911-A |
| titleOfInvention | Preparation of die made of urethane |
| abstract | PURPOSE:To prevent the deterioration of an adhesive due to heating and to strongly bond a urethane resin to a die main body, by coating the surface of a recessed part with a heat resistant epoxy adhesive and applying a compatible primer for urethane to the adhesive of a semicured state. CONSTITUTION:A heat resistant epoxy adhesive 10 is applied to the inner surface of the recessed part 4 of a die main body 1 and a primer 11 for urethane compatible with said adhesive 10 is applied to the adhesive 10 of a semicured state. When an urethane resin 8 is injected in the die main body 1 and cured, heat of about 50 deg.C is generated at a curing time, but the adhesive 10 is not deteriorated by the heat of this degree because of the high heat stability and, coupled with the enhancement of the adhesiveness of the adhesive 10 and the urethane resin 8 due to the primer 11, the bonding strength of the resin layer after curing and the die main body 1 becomes high and, even when press molding is performed 100,000 times at a pitch of 40 times/min under press load of 1kg/m<2>, the release of the resin layer is not generated. |
| priorityDate | 1986-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419480927 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5641 |
Total number of triples: 24.