http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6327574-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 |
| filingDate | 1986-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba7d7f1c76a623f6883785b91a39f2f1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_705229ac7b44243bbcbbd5e4aeeb1efb |
| publicationDate | 1988-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S6327574-A |
| titleOfInvention | Adhesive composition for use in flexible printed wiring board |
| abstract | PURPOSE: To obtain the titled composition highly adhesive to both copper foil and polyimide film, by incorporating an epoxy resin with specified amount of an aromatic amine. n CONSTITUTION: The objective composition can be obtained by incorporating (A) 100pts. by wt. of an epoxy resin (pref. bisphenol A type epoxy resin with an epoxy equivalent 150W1,000 and molecular weight ≥300, dimer acid type epoxy resin with an epoxy equivalent ≥400) with (B) 10W50pts. by wt. of an aromatic amine (pref. diaminodiphenylsolfone, m-phenylenediamine, diami nodiphenylmethane). n COPYRIGHT: (C)1988,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6353015-A |
| priorityDate | 1986-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.