http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63255381-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecc58e5fd0006c472fea1ec2f879638c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 1987-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0fd8aab864299d9e6fc318f4b45722f |
| publicationDate | 1988-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S63255381-A |
| titleOfInvention | Composition for etching accelerator |
| abstract | PURPOSE: To manufacture a composition improving and accelerating etching effects, by adding a compound represented by a specific formula to an aqueous solution of ferric chloride or cupric chloride by a specific quantity. n CONSTITUTION: A compound represented by a formula (AO)SO 3 X (where AO is oxyalkylene and X means hydrogen atom, alkali-metal ion, or NH 4 ) is added to an aqueous solution of ferric chloride or cupric chloride by 0.01W5.0wt.%. Further, as the above oxyalkylene, oxyethylene, oxypropylene, oxybutylene, etc., are cited. In this way, a composition for etching accelerator for printed circuit board improved in dissolution stability, wettability, and penetrability can be obtained. n COPYRIGHT: (C)1988,JPO&Japio |
| priorityDate | 1987-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.