http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63241186-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b8112ab8a1825c66d3aee97d461d8eb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate | 1987-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd58cde4edefca332441718360eb7d3e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f5c164c74fae48bc7b905c53bb3f5d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be4f70be4d0289eb990ba174183b4593 |
| publicationDate | 1988-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S63241186-A |
| titleOfInvention | Electroless plating method |
| abstract | PURPOSE:To obtain a film having superior smoothness and adhesion when a metal is deposited on the surface of a heat resistant base material by electroless plating, by forming an active layer of an inorg. substance on the surface of the base material, adsorbing a catalyst into the pores in the active layer, treating the layer with an alkali or acid and immersing the base material in an electroless plating soln. CONSTITUTION:An active layer of an inorg. substance such as activated alumina or silica is formed on the surface of a heat resistant base material such as glass, ceramics, a crystal body or a metal by spraying or other method. The active layer is dried and backed at 300-1,000 deg.C. By this backing the layer is well activated and converted into an active layer having many micropores. An Sn-Pd catalyst as a plating catalyst is filled and adsorbed into the micropores. The catalyst is infiltrated into the active layer in a patterned state by a photoresist applying method by printing or other method. The active layer is then treated with a soln. of an alkali such as NaOH or an acid such as sulfuric acid and the base material is immersed in an electroless Cu plating soln. to form a patterned Cu film by electroless plating with superior adhesion. |
| priorityDate | 1987-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.