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filingDate 1987-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5b448c18e62c6a04d69ecb67fc2a931
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publicationDate 1988-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S63231336-A
titleOfInvention Negative type resist for double-layered structure
abstract PURPOSE:To make it possible to form a fine pattern even on a substrate having large difference in level by using a compsn. consisting of a silicon modified alkali-soluble resin and an azido or bisazido compd. to form a resist layer. CONSTITUTION:An org. resin layer 2 is formed on a substrate 1 by coating. A photoresist layer 3 consisting of a silicon modified alkali-soluble resin and an azido or bisazido compd. is formed on the layer 2 by coating, patternwise exposed to UV and developed with an alkaline developing soln. The org. resin layer 2 is then etched with oxygen plasma. The resist compsn. has high resolution and superior resistance to oxygen plasma. By using the negative type resist for a double-layered structure, a fine pattern can be formed even when the substrate 1 has large difference in level. The resist is used to produce an electronic circuit device having a fine pattern such as a semiconductor device, a magnetic bubble memory device or a surface wave filter.
priorityDate 1987-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.