http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63213351-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc66a0a99641c512713ae8e57fb6b89
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
filingDate 1987-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbaa406b5368661aa83c025e8cc9fce6
publicationDate 1988-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S63213351-A
titleOfInvention Jig for semiconductor element evaluation test
abstract PURPOSE: To enable right evaluation about effects of water, by using a substrate in which a mounting part for a semiconductor element to be evaluated is cut out to form a pattern, a lead fixed part, and terminals. n CONSTITUTION: A printed substrate 14 is used as follows: a part 11 where a semiconductor element to be evaluated is mounted is cut out, and dew condensation on a belly part of an IC is preventible, and right evaluation about effects of water, which diffuses and penetrates into a valve from the belly part of the IC, is enabled. The whole substrate part, including a side wall 17 of the printed substrate 14 itself and excluding lead fixing parts on which the semiconductor element to be evaluated is fixed, is covered with a resist for substrate use or resin 15. Thus, right evaluation of the semiconductor element is enabled, and further damp-proof performance of the printed substrate itself can be improved and also the range of setting test conditions for damp-proof evaluation can be enlarged. n COPYRIGHT: (C)1988,JPO&Japio
priorityDate 1987-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962

Total number of triples: 13.