http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63191076-A

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Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0a6a69da5879eb83f56f6876dba3e3cf
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
filingDate 1987-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14d0d2ba081dc43cdaaa0e116afd3650
publicationDate 1988-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S63191076-A
titleOfInvention Evaluation of semiconductor apparatus
abstract PURPOSE: To quantitatively evaluate the penetration of moisture due to the deterioration of the interface of a resin and a lead frame within a short period, by immersing a specimen in a solution dissolving aluminum and reducing the pressure of this system and subsequently applying pressure thereto. n CONSTITUTION: A specimen is immersed in the potassium hydroxide solution (H 2 O: KOH=10:1) received in a beaker and the beaker is introduced into a pressure vessel. Thereafter, the pressure vessel is evacuated and nitrogen gas is subsequently introduced into said vessel to adjust the internal pressure thereof to 3atm. The pressure vessel is allowed to stand for 10hr in this state and, after the pressure thereof is returned to 1atm., the specimen is taken out, washed, dried and measured. The solution reaches an Al-pad part through a wire and dissolves Al to bring the specimen to open trouble. By this method, the penetration of water through the interface of a resin and a lead frame can be directly reproduced and the close adhesiveness of the interface of the resin and the lead frame can be directly measured. n COPYRIGHT: (C)1988,JPO&Japio
priorityDate 1987-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 19.