http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6317004-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86df70be6baafcc380c5c26c307c005b |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-44 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27N3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A47B13-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B33-00 |
| filingDate | 1986-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3db3838a821bfe70b7289b38b9ee3f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3038c1d6dc9d95a71476ab383e245bd9 |
| publicationDate | 1988-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S6317004-A |
| titleOfInvention | Ligneous composite material |
| abstract | PURPOSE: To obtain a material, which has favorable appearance, touch and stain resistance and is excellent in durability and suitable for panel material by a method wherein a ligneous composite material, which is produced by imbedding a large number of wooden chips in synthetic resin and the resultant surface of which is ground, is empolyed as surface material. n CONSTITUTION: After the reduction of the water content of wooden chips 1 under green state by drying under heat, the wooden chips 1 are immersed in unsaturated polyester resin or the like and impregnated with the resin and cured. On the other hand, the predetermined amount of the wooden chips subjected to said dimensionally stabilizing treatment is charged in liquid hardening resin such as unsaturated polyester resin or the like or a hardening resin mixture consisting of said liquid hardening resin and filler such as calcium carbonate blended and dispersed with each other and agitated. The surface of a board 4 is treated with primer such as epoxy resin or the like under the state that a frame is provided in the periphery of the board 4 in order to enhance the adhesion. Under the condition as just described above, the mixture of the resin and the wooden chips is cast over the surface of the board 4 and leveled so as to cure the resin at normal temperatures or under heat. After that, the surface of the resultant board is ground with a sanding device in order to obtain a composite material 3 bonded to a board. n COPYRIGHT: (C)1988,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01152001-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020065252-A |
| priorityDate | 1986-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.