| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate |
1985-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56273294d768a6eb535c01b3fbad53aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bf53515ecfdff449450aa1656ce87eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d76dd8a2f196dd0e01b1567a630149e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa1650fb6c58e42d4edf0e7318c72e5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a3ce3bb20300609cc1b9724fb6424ba |
| publicationDate |
1987-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-S6286169-A |
| titleOfInvention |
Electroless plating method |
| abstract |
PURPOSE:To improve the reliability of a copper film having through holes formed by the 1st electroless plating after the preparation of a plating soln. by treating the soln. with activated carbon before the plating so as to remove impurities present in the soln. CONSTITUTION:An aqueous soln. of a complexing agent is mixed with an aqueous soln. of copper ions and an aqueous soln. of a pH adjusting agent, and after the concn. is adjusted, the mixed soln. is treated with activated carbon to prepare a plating soln. The three kinds of aqueous solns. may be treated with activated carbon before mixing. Electroless plating is carried out with the prepd. plating soln. |
| priorityDate |
1985-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |