http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6269648-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1985-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a8278d3904c24e292b036e61ef489d2 |
| publicationDate | 1987-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S6269648-A |
| titleOfInvention | Multilayer interconnection substrate |
| abstract | PURPOSE:To realize a decrease in source wiring resistance, by composing a substrate of a glass-ceramic material, and therein providing a through-hole wiring which passes through the source wiring layer and front/back surfaces of the substrate, and besides forming lamination of conductor wirings in multi- layers with polyimide resin serving as an insulating layer on one surface of the substrate. CONSTITUTION:A surface-exposed part of through-hole wiring 11 is formed on the surface of a glass-ceramic substrate 1. Because through-hole wiring 8, which is formed only by inserting conductor paste for printing and firing it,is composed of many recessed and projecting parts on its surface, the surface of the substrate is ground to become smooth after firing in order to facilitate formation of a multilayer wiring 2. An insulating layer 14 made of polyimide- group resin is formed on the obtained substrate 1. Via-hole wiring 15 is formed by making via-holes as a means for having continuity of the conductor wiring 12 and the upper layer. Besides, conductor wiring 16 is formed. These processes are repeated to have multi-layers. Because the substrate 1 is sintered in air, gold can be used in all wiring layers. hence, a decrease in wiring resistance can be realized. |
| priorityDate | 1985-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.