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filingDate 1985-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1987-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S6259678-A
titleOfInvention Adhesive for additive printed circuit board
abstract PURPOSE: To enhance the soldering heat resistance of a printed circuit board and bonding strength of a circuit and improve component exchangeability, by forming an adhesive for a printed circuit board with an acrylonitrile- butadiene rubber and a maleimide derivative. n CONSTITUTION: An adhesive comprising an acrylonitrile-butadiene rubber and a maleimide derivative contg. at least two maleimide groups. It is preferred that the adhesive be one obtd. by homogeneously mixing 30W70pts.wt. acrylonitrile-butadiene rubber and 70W30pts.wt. maleimide derivative with an org. solvent. Examples of the maleimide derivative include compds. of formulae I and II. The org. solvent may be at least one member selected from among toluene, methyl ethyl ketone, acetone, ethyl acetate, etc. n COPYRIGHT: (C)1987,JPO&Japio
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