http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6254780-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate | 1985-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80ae64955330f23fe2e2c694a4f63554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad71bdbcff6573050d1d334dd847b01c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_410495e88706b3193dde853368ec4545 |
| publicationDate | 1987-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S6254780-A |
| titleOfInvention | Adhesion composition for flexible printed-wiring board |
| abstract | PURPOSE: To obtain an adhesion composition for a flexible printed-wiring board having excellent adhesiveness, heat resistance, moisture resistance, flame retardancy, etc., by incorporating three kinds of specified resins, an accelerator, and an inorganic filler into an acrylic elastomer containing functional groups. n CONSTITUTION: An acrylic elastomer (A) containing one or more kinds of functional groups selected from among epoxy, carboxyl and hydroxyl groups is mixed with a poly-p-vinylphenol resin (B), an epoxy resin (C), a polyvinyl butyral resin (D), an accelerator (E) (e.g., dicyandiamide), and an inorganic filler (F) (e.g., silica), as essential components, to give the titled adhesion composition. A suitable amount of component A is 30W70wt% and that of component D is 0.5W5wt%, based on the total of A, B, C and D; the equivalent ratio of the phenolic hydroxyl group of component B to the epoxy group of component C is preferably 0.5W7. n COPYRIGHT: (C)1987,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5066691-A |
| priorityDate | 1985-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.