| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1985-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e18c54fa12b574cbe0bc07755fc21986
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_667ba8bf13bb484c6a71c931c41808ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb24d2d83e6d9815fcbdbe53b47fe879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c073546f2eefd5a0962402278fa29e6 |
| publicationDate |
1987-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-S6245615-A |
| titleOfInvention |
Epoxy resin composition for sealing semiconductor device |
| abstract |
PURPOSE:The titled composition excellent in heat shock resistance, comprising an epoxy resin, a novolak phenolic resin, a phenolaralkyl resin and a specified styrene copolymer. CONSTITUTION:100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule and having a softening point of 60-100 deg.C and an epoxy equivalent weight of 100-300, which may contain 30wt% or below flame-retarding epoxy resin, is mixed with 50-90pts.wt. total of 10-50pts.wt. novolak phenolic resin of a softening point of 60-120 deg.C and a hydroxyl equivalent of 100-150 and 10-50pts.wt. phenolaralkyl resin (B) of a softening point of 80-120 deg.C and a hydroxyl equivalent of 195-235 and 2-40pts.wt. carboxyl group- containing styrene copolymer (C) (e.g., styrene/maleic acid copolymer) and this mixture is melted and kneaded. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0285450-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007261238-A |
| priorityDate |
1985-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |