http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S624328-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0beb0ca01b0226be7efa801438fcf33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 1985-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_caf3441ae1668b8e789e7256a2544f66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b3bfc2ac3df1377674882d49c923629 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62878e31bb7d82ba99f2068e07ff981d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8f2df292542dc2d3d45af1b68f39d1c |
| publicationDate | 1987-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S624328-A |
| titleOfInvention | Semiconductor resin molding die |
| abstract | PURPOSE: To extend the life of a semiconductor resin molding die and improve the productivity of resin-molded semiconductors by a method wherein at lest cavities and resin channels formed in an upper die and a lower die which compose the semiconductor resin molding die are coated with hard alloy films. n CONSTITUTION: Lead frames on which semiconductor elements are bonded are fitted to the lower die of a semiconductor resin molding die. Resin is supplied through resin channels into cavities which are formed by tightening the upper die and the lower die together and the lead frames are molded in the resin to form resin molded semiconductors. For this purpose, at least the cavities 4 and the resin channels (pots 3, runners 6 and gates 5) of the upper die and the lower die are coated with hard alloy films 14. With this constitution, the life of the resin molding die can be extended and the productivity of the resin molded semiconductors can be improved. n COPYRIGHT: (C)1987,JPO&Japio |
| priorityDate | 1985-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 |
Total number of triples: 20.