http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62285447-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate 1986-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1987-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S62285447-A
titleOfInvention Formation of electrical connection contact
abstract PURPOSE: To obtain an electric contact having high reliability simply by contact- bonding a projection formed by using a nail head joining technique to a low melting-point alloy or a metallic surface fused onto a support board and transferring the low melting-point alloy or the metallic surface onto the contact. n CONSTITUTION: A gold wire is penetrated into a capillary 4, a ball 5 shaped at the tip of the gold wire is fixed to a pad 2 in a substrate 1, the root of the wire is cut and a projection 5 is formed. The projections 5 are fused to the surface of a low melting-point alloy or a metal 8 fused onto a support base material 7 on a heating head 9, and the low melting-point alloy or the metal 8 is transferred only onto the crushed projections 10. The contacts and ITO electrodes 12 on a glass substrate 11 are faced oppositely and contact- bonded, and the alloys or the metals 8 on the crushed projections 10 are melted and fastened by a heating head 13, thus connecting an IC chip and the glass substrate. n COPYRIGHT: (C)1987,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0228935-A
priorityDate 1986-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 19.