http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62260816-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
| filingDate | 1986-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb7fa5a4d069afd45b444dac61c41a50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b77041eb21fdbd7bde500b8aae0e47e9 |
| publicationDate | 1987-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S62260816-A |
| titleOfInvention | Epoxy resin composition |
| abstract | PURPOSE: To obtain the title low-stress composition excellent in moldability and cracking resistance after heat shock and moisture resistance and useful for semiconductor sealing, comprising a thermoplastic rubber having a specified glass transition point and a specified softening point. n CONSTITUTION: An epoxy resin (A) (e.g., novolak epoxy resin) is mixed with 0.5W1.2 equivalent, per epoxy equivalent of component A, of a curing agent (B) (e.g., phthalic anhydride), a cure accelerator (C) (e.g., trimethylamine) and 0.1W10wt% thermoplastic rubber (D) (e.g., acrylonitrile/butadiene copolymer) which is a copolymer which comprises a soft segment and a hard segment incompatible with each other and in which the respective components form independent phases at normal temperature to form a sea-island structure and which has a glass transition point ≤20°C, preferably, ≤0°C and a softening point ≥130°C, preferably, of 150W260°C. n COPYRIGHT: (C)1987,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0372747-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6046257-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005015563-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4557509-B2 |
| priorityDate | 1986-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.