http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62212644-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-28
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filingDate 1986-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b826d1f4e68b694e2187d58559b75c7a
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publicationDate 1987-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S62212644-A
titleOfInvention Photosensitive resin composition
abstract PURPOSE:To obtain a photosensitive resin compsn. which has high sensitivity to light and high definition and has high resistance to dry etching by contg. a specific siloxane polymer, bisazide compd. and sensitizer. CONSTITUTION:The photosensitive resin compsn. contg. the siloxane polymer expressed by the formula I or II, the bisazide compd. and the sensitizer is formed. An example of the bisazide compd. includes the compd. expressed by the formula III and the amt. of said compd. to be added is preferably 0.5-30wt% per the weight of the siloxane polymer expressed by the formula I. In the formula, X denotes one kind selected from a carboxyl group, etc., R, R', R'' denote hydrogen and one kind of the group selected from the group consisting of alkyl group and phenyl group, l-n denote 0 or positive integer. Sensitizers which are used with the conventional photoresist are usable for the sensitizer. This photosensitive resin compsn. has the high sensitivity to light and is hardly etched by an etchant gas such as Cl2 to be used for reactive etching.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7026099-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62220949-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013512986-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0328852-A
priorityDate 1986-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.