http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62101044-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 1985-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b58676762e9f8c0c92f0481a67867af9 |
| publicationDate | 1987-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S62101044-A |
| titleOfInvention | Manufacture of hybrid integrated circuit device |
| abstract | PURPOSE: To improve the yield of a hybrid integrated circuit having high reliability and high heat resistance, and to reduce cost thereof by aging a chip part on a substrate under clean environment prior to hermetic seal and repairing or exchanging defectives on the basis of electric function inspection. n CONSTITUTION: A chip part 4 such as an IC chip is mounted on a die bonding pad 2 on a multilayer interconnection substrate 1 through epoxy group adhesives 3 while the chip part 4 and wire bonding pads 5 on the multilayer interconnection substrate 1 are bonded by wires 6 in gold, etc. Electric function inspection is conducted, bias is applied in order to generate initial defectives in the chip parts, the chip parts are aged through heating for approximately 96W240hr at a temperature such as 100W125°C in a clean oven, initial defective chip parts are discovered through electric function inspection, and the parts are repaired or exchanged. The chip parts are hermetically sealed according to a conventional procedure. n COPYRIGHT: (C)1987,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111130536-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111130536-A |
| priorityDate | 1985-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 |
Total number of triples: 22.