http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6196478-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 1984-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e89a6b15def103e8ea5da0556df00307 |
| publicationDate | 1986-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S6196478-A |
| titleOfInvention | Testing method of humidity resistance of semiconductor device |
| abstract | PURPOSE: To appreciate the intensity of humidity resistance more precisely under high working property by mounting a semiconductor device sealed with resin on a socket, and after dipping a part of the socket and terminals into a tank of solder melted with heat, leaving the solder as it is in high temperature and high humidity atmosphere. n CONSTITUTION: The dual inpackage type semiconductor device 101 sealed with resin is mounted on the socket having electrodes 104 obtained by plating gold on the surface of a substrate 103 consisting of ceramics. The whole socket and a part of respective electrodes are dipped into the solder tank 105 kept at about 230°C so that the solder is not contacted with the package of the IC and held as it is for about 10sec. Consequently, the electrode terminals of the socket are adhered by the solder precisely and set up to the state adopting thermal history equal to that of the mounting time. The IC dipped into the solder is sealed into a pressure oven 106 generating about 125°C and 100% saturated steam, and after leaving the IC as it is for several 10hr, the electric characteristics of the IC are checked by an IC tester. n COPYRIGHT: (C)1986,JPO&Japio |
| priorityDate | 1984-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 |
Total number of triples: 13.