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filingDate 1984-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1986-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S6195029-A
titleOfInvention Production of polyimide resin powder, bonding method and film-forming method using polyimide resin powder
abstract PURPOSE: To obtain the titled resin powder having excellent melt fluidity and heat-resistance, and useful as a heat-resistant adhesive, coating material, etc., by chemically imidating a polyamidic acid having a specific recurring unit with a dehydrative imidating agent. n CONSTITUTION: The objective resin powder having the recurring unit of formula VI can be prepared by chemically imidating the polyamidic acid having the recurring unit of formula I [R 1 is group of formula II or formula III (Z is -CH 2 -, -O-, -SO 2 -, -NR 3 -, etc.); R 2 is group of formula IV or formula V; R 3 is alkyl or aryl; Y is H, alkyl or aryl] with a dehydrative imidating agent (e.g. acetic anhydride). The polyamidic acid having the unit of formula I can be prerpared by reacting 3,3'-diaminobenzophenone with 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride in a polar aprotic solvent such as N,N-dimethylacetamide. The obtained reaction solution can be used as it is for the amidation reaction. n COPYRIGHT: (C)1986,JPO&Japio
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H046334-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8115588-B2
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priorityDate 1984-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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