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filingDate 1984-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d87b50a030c041088dd0c3874020aec
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publicationDate 1986-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S6176521-A
titleOfInvention Photo-setting resin composition for sealing
abstract PURPOSE: To obtain the titled composition having excellent adhesivity, sealability, etc., by compounding a resin having a butadiene (co)polymer as a main skeleton and having epoxy group at the molecular terminal and/or side chain, an epoxy resin, a photo-sensitive aromatic onium salt, and a sensitizer. n CONSTITUTION: The objective composition can be produced by compounding (A) 10W70pts.(wt.) of a resin having butadiene (co)polymer as the main skeleton and having ≥1.5 epoxy groups at the molecular terminal and/or side chain on an average, (B) 90W30pts. of alicyclic, bisphenol A type and F type, novolac- type, and/or hydrogenated bisphenol A type epoxy resins, (C) a photo-sensitive aromatic onium salt and (D) a sensitizer selected from polynuclear aromatic compound, polynuclear heterocyclic compound and their derivatives, having ultraviolet or visible light absorption at 320W500nm (e.g. naphthalene, quinoline, etc.). The amounts of the components C and D are 0.1W5pts. and 0.001W0.5pts. per 100pts. of A+B. n COPYRIGHT: (C)1986,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100779775-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2021157298-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6217729-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008203854-A
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priorityDate 1984-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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