| abstract |
PURPOSE: To obtain bonding wire having superior strength, small deviation in strength, by incorporating specified ratios of rare earth elements, etc. to high purity Au. n CONSTITUTION: Mother alloy having compsn. ratio consisting of 0.0001W0.01wt% at least one kind selected from elements group composed of Y and rare earth elements, 0.0005W0.01wt% at least one kind selected from elements group composed of B, Sr, Mg, Bi, Ni and the balance Au of 99.99% high purity is prepared. The mother alloy is melted in inert gas atmosphere or vacuum, casted then rolled to a fixed wire diameter, and said material is wire drawn by dies having smaller diameter in order. In this way, bonding wire favorable to electrical contact between semiconductor element and outer lead wire is obtd. n COPYRIGHT: (C)1986,JPO&Japio |