http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6136976-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-792
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8247
filingDate 1984-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c73335b7133ae18b74c45e6ebb1dd66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5c27be02d1133fdded0001692c8e504
publicationDate 1986-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S6136976-A
titleOfInvention Manufacture of semiconductor memory device
abstract PURPOSE:To obtain the MONOSFET comprising good memory maintaining properties by implanting hydrogen ions after forming the second silicon oxide film on a silicon nitride film and further subjecting the substrate to a heat treatment at the same temperature as in the case of forming the silicon nitrde film. CONSTITUTION:A source region 2 and a drain region 3 are formed on an N type silicon substrate 1 and a silicon oxide film 5 is formed in an opening part of a silicon oxide film 4. Next, after a silicon nitride film 6 is gas-phase grown on said silicon film 5, the surface of silicon film 6 is oxidized by a heat treatment to produce a silicon oxide film 7. Subsequently, hydrogen ions 8 are implanted into the whole substrate, after which the heat treatment at the same temperature as in the case of forming the silicon nitride film 6 is effected. Lastly, an aluminum electrode 9 and a silicon oxide film 10 are formed and thus the P-channel MONOS nonvolatile memory device is fabricated.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007173398-A
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priorityDate 1984-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 31.