http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61296749-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0345001e918f6aed4484e790b33ddcb6
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filingDate 1985-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ede985440dfdbdf721e4fae2f0ce3819
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publicationDate 1986-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S61296749-A
titleOfInvention Lead frame for semiconductor device
abstract PURPOSE: To facilitate the wire bonding by connecting the inner leads mutually or the top section of an inner lead to a tab with a heat-proof resin film on which a heat-adhesive silicon hardening member is laminated. n CONSTITUTION: A rectangular tab 2 on which a semiconductor chip is mounted is supported by two leads 3 for hanging the tab extended from a lead frame body 1. Around the tab 2, 14 inner leads 4 are arranged so that the tops of them surround the tab. The other ends of the inner leads 4 continuously formed with the external lead terminal 5. All the inner leads 4 are connected by adhering a heat-proof resin film 6 on which a rectangular heat-adhesive silicon hardening body is laminated on the front surface of the middle parts of the inner leads 4. n COPYRIGHT: (C)1986,JPO&Japio
priorityDate 1985-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 19.