| abstract |
PURPOSE:A curable material having high sensitivity, high resolution and dry- etching resistance, comprising a specified compound and a curing agent. CONSTITUTION:0.01-60pts.wt. curing agent (e.g., benzoyl peroxide) is added to 100pts.wt. compound obtained by replacing 1-99% of R0 substituents in a compound having repeating structural units of formula I (wherein R0 is vinyl, epoxy or episulfide, R1 is H, a 1-6C alkyl or a halogen and R1 and R2 are each a substituent ortho, meta or para to the bond to the skeletone) and of formula II (wherein W, X, Y and Z are each H, a halogen, cyano, 1 -6C (halo) alkyl or a 6-30C aryl having such a substituent, a 6-30C aryl which may have a silyl-containing group substituent, -COOR2, -COR2 or -O-COR2, R2 is a 1-12C (halo)alkyl, a 6-30C aryl having such a substituent or the like] with silicon-containing substituents. |