http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61208855-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 |
| filingDate | 1985-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dae2e45c4515f2b64d0a89bee10bd4d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5113d7249fa5ea613342a96cf67e29e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1dc9c5ec95b89beb80b7068be8bf47a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07badbaa7d5b34018b65cdf9f536190d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9859cda8c5349bc43a44e4dc406e9fb4 |
| publicationDate | 1986-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S61208855-A |
| titleOfInvention | Manufacture of ceramic substrate for wiring |
| abstract | PURPOSE:To make tight adhesion possible, by forming the glass layer composed of one kind or more kinds of crystallized glass, and forming the metal film on the glass layer after chemical etching of the glass layer surface. CONSTITUTION:On the ceramic substrate, the glass layer is formed which is composed of one kind or more kinds of crystallized glasses, non-crystalline glass containing refractory compound as the filler and crystallized glass containing refractory compound as the filler. After chemical etching of the glass layer surface, the metal film is formed on the glass layer by electroless plating. For the refractory compound which is used as the filler in the non- crystalline glass or crystalline glass, many kinds of oxide, nitride and carbide, etc. are applicable, which are thermally stable at the burning temperature of glass powder and hardly react with glass under said temperature. Generally, Al2O3, SiO2, mixture of these materials and composite oxide of these materials are suitable. Thus, the ceramic substrate on which conductor tightly adheres can be manufactured without decrease of the strength of ceramic substrate. |
| priorityDate | 1985-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069 |
Total number of triples: 24.